%% This BibTeX bibliography file was created using BibDesk.
%% http://bibdesk.sourceforge.net/


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@article{Jing:microEM,
	Author = {Abella, J. and Vera, X. and Unsal, O.S. and Ergin, O. and Gonzalez, A. and Tschanz, J.W.},
	Journal = {Micro, IEEE},
	Number = {6},
	Pages = {37},
	Title = {Refueling: Preventing Wire Degradation due to Electromigration},
	Volume = {28},
	Year = {2008}}

@article{Jing:BlackEM,
	Author = {Black, J.R.},
	Journal = {Proc. of the IEEE},
	Number = {9},
	Pages = {1587},
	Title = {Electromigration failure modes in aluminum metallization for semiconductor devices},
	Volume = {57},
	Year = {1969}}

@article{Jing:taiwanEM,
	Author = {Cheng, Yi-Lung and Chang, We-Yuan and Wang, Ying-Lang},
	Journal = {JVST B},
	Number = {5},
	Pages = {973},
	Title = {Line-width dependency on electromigration performance for long and short copper interconnects},
	Volume = {28},
	Year = {2010}}

@article{Jing:xuanEM,
	Author = {X.Xuan},
	Journal = {Ph.D thesis, Georgia Inst. of Technology},
	Title = {Analysis and Design of Reliable Mixed-Signal CMOS Cicuits},
	Year = {2004}}

@inproceedings{Jing:vlsid05,
	Author = {Lienig, J. and Jerke, G.},
	Booktitle = {Int’l Conf. on VLSI Design},
	Pages = {77},
	Title = {Electromigration-aware physical design of integrated circuits},
	Year = {2005}}

@inproceedings{Jing:IEEE99,
	Author = {Hu, C.-K. and Rosenberg, R. and Rathore, H.S. and Nguyen, D.B. and Agarwala, B.},
	Booktitle = {IITC},
	Pages = {267},
	Title = {Scaling effect on electromigration in on-chip Cu wiring},
	Year = {1999}}

@inproceedings{Jing:DACEM,
	Author = {Dasgupta, A. and Karri, R.},
	Booktitle = {DAC},
	Pages = {353},
	Title = {Electromigration reliability enhancement via bus activity distribution},
	Year = {1996}}

@inproceedings{Jing:ISCAEM,
	Author = {Srinivasan, J. and Adve, S.V. and Bose, P. and Rivers, J.A.},
	Booktitle = {ISCA},
	Pages = {276},
	Title = {The case for lifetime reliability-aware microprocessors},
	Year = {2004}}

@manual{Jing:sparc,
	Author = {oracle},
	Title = {http://www.opensparc.net/},
	Bdsk-Url-1 = {http://www.opensparc.net/}}
	
@inproceedings{Jing:Loh,
 author = {Loh, Gabriel H.},
 title = {3D-Stacked Memory Architectures for Multi-core Processors},
 booktitle = {ISCA},
 year = {2008},
 pages = {453}
}

@article{Jing:ACM,
 author = {Zhan, Yong and Sapatnekar, Sachin S.},
 title = {Automated module assignment in stacked-Vdd designs for high-efficiency power delivery},
 journal = {J. Emerg. Tech. Comput. Syst.},
 volume = {4},
 issue = {4},
 year = {2008},
 pages = {18:1},
}

@manual{Jing:imecweb,
	Author = {imec},
	Date-Modified = {2010-11-15 01:44:57 -0500},
	Title = {http://www.imec.be},
	Bdsk-Url-1 = {http://www.imec.be/}}
	

@ARTICLE{Jing:add,
author={Jiang Tao and Chen, J.F. and Cheung, N.W. and Chenming Hu},
journal={IEEE Trans. Electron Devices}, title={Modeling and characterization of electromigration failures under bidirectional current stress},
year={1996},
volume={43},
number={5},
pages={800},
}

@ARTICLE{260787,
author={Tao, J. and Cheung, N.W. and Hu, C.},
journal={IEEE Electron Device Lett.}, 
title={Metal electromigration damage healing under bidirectional current stress},
year={1993},
volume={14},
number={12},
pages={554},
}

@INPROCEEDINGS{5232735,
author={Yi-Lung Cheng and Bor-Jou Wei and Yi-Lung Wang},
booktitle={IPFA}, 
title={Electromigration characteristics of copper dual damascene interconnects - line length and via number dependence},
year={2009},
pages={723},
}

@INPROCEEDINGS{4558988,
author={Yi-Lung Cheng and Lee, S.Y. and Chiu, C.C. and Wu, K.},
booktitle={IRPS}, 
title={Back stress model on electromigration lifetime prediction in short length copper interconnects},
year={2008},
pages={685},
}

@ARTICLE{4633651,
author={Qiaojian Huang and Lilley, C.M. and Divan, R. and Bode, M.},
journal={IEEE Trans. on Nanotech.}, title={Electrical Failure Analysis of Au Nanowires},
year={2008},
volume={7},
number={6},
pages={688},
}

@article{Jing:jwm,
	Author = {J. W. Morris and C. U. Kim and S. H. Kang},
	Journal = {J. Optim. Theory Appl.},
	Number = {5},
	Pages = {43},
	Title = {The Metallurgical Control of Electromigration Failure in Narrow Conducting Lines},
	Volume = {48},
	Year = {1996}}

@article{Tao1998295,
title = "Electromigration under time-varying current stress",
journal = "Microelectronics Reliability",
volume = "38",
number = "3",
pages = "295",
year = "1998",
author = "Jiang Tao and Boon-Khim Liew and Jone F. Chen and Nathan W. Cheung and Chenming Hu"
}

@INPROCEEDINGS{36348,
author={Liew, B.K. and Cheung, N.W. and Hu, C.},
booktitle={IRPS}, 
title={Electromigration interconnect lifetime under AC and pulse DC stress },
year={1989},
pages={215},
}

@ARTICLE{4859008,
author={Cho, J. and Thompson, C. V.},
journal={Appl. Phys. Lett.}, 
title={Grain size dependence of electromigration-induced failures in narrow interconnects},
year={1989},
volume={54},
number={25},
pages={2577},
}

@article{Arnaud1999773,
title = "Influence of pulsed DC current stress on electromigration results in AlCu interconnections; analysis of thermal and healing effects",
journal = "Microelectronics Reliability",
volume = "39",
number = "6-7",
pages = "773",
year = "1999",
author = "L. Arnaud and G. Reimbold and P. Waltz"
}

@INPROCEEDINGS{283282,
author={Ting, L.M. and May, J.S. and Hunter, W.R. and McPherson, J.W.},
booktitle={IRPS}, 
title={AC electromigration characterization and modeling of multilayered interconnects},
year={1993},
pages={311},
}

@INPROCEEDINGS{Jing:PADdensity,
author={Hwai Peng Yeoh and Mirng-Ji Lii and Sankman, B. and Azimi, H.},
booktitle={EPTC}, 
title={Flip chip pin grid array (FC-PGA) packaging technology},
year={2000},
pages={33},
}
